Articles citing this article

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Cited article:

An analytical review on interfacial reactions in high-temperature die-attach: the insights into the effect of surface metallization and filler materials

Canyu Liu, Changqing Liu

Manufacturing Rev., 12 (2025) 1

Published online: 2025-01-03

DOI: https://doi.org/10.1051/mfreview/2024024

This article has been cited by the following article(s):

Study on the interface interaction between the chip backside metallization and solder alloys of power semiconductor modules

Shilin Zhao, Erxian Yao, Chunbiao Wang and Yan Tong
Journal of Materials Science: Materials in Electronics 36 (27) (2025)
https://doi.org/10.1007/s10854-025-15818-4