Review

An analytical review on interfacial reactions in high-temperature die-attach: the insights into the effect of surface metallization and filler materials

School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Luoyu Road 1037, 430074 Wuhan, China

^* e-mail: lcq5563@hust.edu.cn

Received: 30 October 2024
Accepted: 4 December 2024

Abstract

This review provides a comprehensive analysis of interfacial reactions and the impact of surface metallization in high-temperature die-attach, which is critical for ensuring the reliability of interconnects and joints in power electronic module packaging and integration. With the emergence of high-temperature filler materials, distinctive features in interfacial interactions and microstructural evolution arise, necessitating detailed examination to select suitable surface finishes based on the filler metals and specific applications. Metallization does not always enhance joint quality and reliability, so cost-effectiveness and manufacturability must also be considered when metallization is deemed viable. The formation of intermetallic compounds (IMCs) during interfacial reactions is particularly important, although solid solution formation at interfaces also warrants attention. This review evaluates five commonly used high-temperature metal solder fillers—high-Pb solder, Au-based solder, Bi-Ag solder, Zn-Al solder, and nano Ag paste—focusing on their interactions with various metallized surfaces in die-attach bonding. The effects of metallization on interfacial reactions and bond formation are discussed, leading to recommendations for cost-effective and reliable metallizations suitable for these applications.