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Home All issues Volume 12 (2025) Manufacturing Rev., 12 (2025) 1 References
Issue
Manufacturing Rev.
Volume 12, 2025
Special Issue - 21st International Conference on Manufacturing Research - ICMR2024
Article Number 1
Number of page(s) 20
DOI https://doi.org/10.1051/mfreview/2024024
Published online 03 January 2025
  1. R. Khazaka, L. Mendizabal, D. Henry, R. Hanna, Survey of high-temperature reliability of power electronics packaging components, IEEE Trans. Power Electron. 30 (2015) 2456–2464 [CrossRef] [Google Scholar]
  2. K.S. Siow, Mechanical properties of nano-silver joints as die attach materials, J. Alloys Compd. 514 (2012) 6–19 [CrossRef] [Google Scholar]
  3. C. Liu, A. Liu, Y. Su, Y. Chen, Z. Zhou, C. Liu, Ultrasonically enhanced flux-less bonding with Zn-5Al alloy under ambient condition for high-temperature electronics interconnects, J. Manuf. Process. 73 (2022) 139–148 [CrossRef] [Google Scholar]
  4. Y. Gao, J. Jiu, C. Chen, K. Suganuma, R. Sun, Z.Q. Liu, Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test, J. Mater. Sci. Technol. 115 (2022) 251–255 [CrossRef] [Google Scholar]
  5. Z. Xu, D. Jiang, M. Li, P. Ning, F.F. Wang, Z. Liang, Development of Si IGBT phase-leg modules for operation at 200 °C in hybrid electric vehicle applications, IEEE Trans. Power Electron. 28 (2013) 5557–5567 [CrossRef] [Google Scholar]
  6. A.B. Jorgensen, S. Munk-Nielsen, C. Uhrenfeldt, Overview of digital design and finite-element analysis in modern power electronic packaging, IEEE Trans. Power Electron. 35 (2020) 10892–10905 [CrossRef] [Google Scholar]
  7. H.S. Chin, K.Y. Cheong, A.B. Ismail, A review on die attach materials for SiC-based high-temperature power devices, Metall. Mater. Trans. B 41 (2010) 824–832 [Google Scholar]
  8. H. Lee, V. Smet, R. Tummala, L. Fellow, A review of SiC power module packaging technologies: challenges, advances, and emerging issues, IEEE J. Emerg. Sel. Top. Power Electron. 8 (2020) 239–255 [CrossRef] [Google Scholar]
  9. Y. Li, C.P. Wong, Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications, Mater. Sci. Eng. R Reports 51 (2006) 1–35 [CrossRef] [Google Scholar]
  10. S.A. Paknejad, S.H. Mannan, Review of silver nanoparticle based die attach materials for high power/temperature applications, Microelectron. Reliab. 70 (2017) 1–11 [CrossRef] [Google Scholar]
  11. C. Tsai, W. Huang, C.R. Kao, L.M. Chew, W. Schmitt, Die attachment applications of power ICs, In 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (2020) 1430–1435, doi: 10.1109/ECTC32862.2020.00226. [Google Scholar]
  12. H. Zhang, J. Minter, N.C. Lee, A brief review on high-temperature, Pb-free die-attach materials, J. Electron. Mater. 48 (2019) 201–210 [Google Scholar]
  13. S. Zhang, Q. Wang, T. Lin, P. Zhang, P. He, K.W. Paik, Cu-Cu joining using citrate coated ultra-small nano-silver pastes, J. Manuf. Process. 62 (2021) 546–554 [CrossRef] [Google Scholar]
  14. H. Yongle, L. Yifei, X. Fei, L. Binli, T. Xin, Physics of failure of die-attach joints in IGBTs under accelerated aging: evolution of micro-defects in lead-free solder alloys, Microelectron. Reliab. 109 (2020) 113637 [CrossRef] [Google Scholar]
  15. L. Yan et al., Study of thermal stress fluctuations at the die-attach solder interface using the finite element method, Electron. 11 (2022), doi: 10.3390/electronics11010062 [Google Scholar]
  16. K. Sugiura et al., First failure point of a SiC power module with sintered Ag die-attach on reliability tests, no. 2 mm, 2-5 In 2017 International Conference on Electronics Packaging (ICEP) (2017) 97–100 [Google Scholar]
  17. J. Li, C.M. Johnson, C. Buttay, W. Sabbah, S. Azzopardi, Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles, J. Mater. Process. Technol. 215 (2015) 299–308 [CrossRef] [Google Scholar]
  18. N. Wu, Y. Hu, S. Sun, Microstructure characterization and interfacial reactions between Au-Sn solder and different back metallization systems of GaAs MMICs, Materials (Basel) 13 (2020) 1–12 [Google Scholar]
  19. A. Hassan, Y. Savaria, M. Sawan, Electronics and packaging intended for emerging harsh environment applications: a review, IEEE Trans. Very Large Scale Integr. Syst. 26 (2018) 2085–2098 [CrossRef] [Google Scholar]
  20. M. Wang, Y. Mei, S. Member, W. Hu, X. Li, G. Lu, Pressureless sintered-silver as die attachment for bonding Si and SiC chips on silver, gold, copper, and nickel metallization for power electronics packaging: the practice and science, IEEE J. Emerg. Sel. Top. Power Electron. 10 (2022) 2645–2655, doi: 10.1109/JESTPE.2022.3150223 [Google Scholar]
  21. F. Yu, J. Cui, Z. Zhou, K. Fang, R.W. Johnson, M.C. Hamilton, Reliability of Ag sintering for power semiconductor die attach in high-temperature applications, IEEE Trans. Power Electron. 32 (2017) 7083–7095 [CrossRef] [Google Scholar]
  22. K.-Y. Chiu, P.-I. Lee, Solid-liquid interdiffusion bonding between Ti/Ni/Ag/Sn backside metallized si chips and Cu/Al2O3-DBC substrates with Au/Pd/Ni surface finish, Int. J. Mining, Mater. Metall. Eng. 8 (2022) 1–7 [Google Scholar]
  23. F.J. Yeh, T.C. Chiu, K.L. Lin, The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test, 14th Int. Conf. Electron. Mater. Packag. EMAP 2012, 1 (2012), doi: 10.1109/EMAP.2012.6507860 [Google Scholar]
  24. M. Wang, Y. Mei, W. Hu, X. Li, G.Q. Lu, Pressureless Sintered-silver as die attachment for bonding Si and SiC chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science, IEEE J. Emerg. Sel. Top. Power Electron. 6777 (2022) 2645–2655 [CrossRef] [Google Scholar]
  25. Y. Zhang et al., Coexistent improvement of thermal and mechanical performance at Si/Cu joint by thickness-controlled Sn-Ag bond layer, J. Manuf. Process. 101 (2023) 104–113 [CrossRef] [Google Scholar]
  26. G. Zeng, S. Xue, L. Zhang, L. Gao, W. Dai, J. Luo, A review on the interfacial intermetallic compounds between Sn-Ag-Cu based solders and substrates, J. Mater. Sci. Mater. Electron. 21 (2010) 421–440 [CrossRef] [Google Scholar]
  27. H. Huang, X. Guo, F. Bu, G. Huang, Corrosion behavior of immersion silver printed circuit board copper under a thin electrolyte layer, Eng. Fail. Anal. 117 (2020) 104807 [CrossRef] [Google Scholar]
  28. Q.V. Bui et al., Corrosion protection of ENIG surface finishing using electrochemical methods, Mater. Res. Bull. 45 (2010) 305–308 [CrossRef] [Google Scholar]
  29. S.F. Muhd Amli, M.A.A. Mohd Salleh, R. Mohd Said, N.R. Abdul Razak, J.A. Wahab, M.I.I. Ramli, Effect of surface finish on the wettability and electrical resistivity of Sn-3. 0Ag-0.5Cu solder, IOP Conf. Ser. Mater. Sci. Eng. 701 (2019) 1–7 [Google Scholar]
  30. S.Y. Zhao, X. Li, Y.H. Mei, G.Q. Lu, Novel interface material used in high power electronic die-attaching on bare Cu substrates, J. Mater. Sci. Mater. Electron. 27 (2016) 10941–10950 [CrossRef] [Google Scholar]
  31. D. Goyal, T. Lane, P. Kinzie, C. Panichas, K.M. Chong, O. Villalobos, Failure mechanism of brittle solder joint fracture in the presence of Electroless Nickel Immersion gold (ENIG) interface, Proc. − Electron. Components Technol. Conf. (2002) 732–739 [CrossRef] [Google Scholar]
  32. F. Lang, H. Yamaguchi, H. Ohashi, H. Sato, Improvement in joint reliability of SiC power devices by a diffusion barrier between Au-Ge solder and Cu/Ni(P)-metalized ceramic substrates, J. Electron. Mater. 40 (2011) 1563–1571 [CrossRef] [Google Scholar]
  33. K. Zeng, K.N. Tu, Six cases of reliability study of Pb-free solder joints in electronic packaging technology, Mater. Sci. Eng. R Reports 38 (2002) 55–105 [CrossRef] [Google Scholar]
  34. T. Laurila, V. Vuorinen, J.K. Kivilahti, Interfacial reactions between lead-free solders and common base materials, Mater. Sci. Eng. R Reports 49 (2005) 1–60 [CrossRef] [Google Scholar]
  35. P. Yi, K. Xiao, C. Dong, S. Zou, X. Li, Effects of mould on electrochemical migration behaviour of immersion silver finished printed circuit board, Bioelectrochemistry 119 (2018) 203–210 [CrossRef] [Google Scholar]
  36. Q. Xu, Y. Mei, X. Li, G.Q. Lu, Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates, J. Alloys Compd. 675 (2016) 317–324 [CrossRef] [Google Scholar]
  37. E. Long and L. Toscano, Electroless nickel/immersion silver − A new surface finish PCB applications, Met. Finish. 111 (2013) 12–19 [CrossRef] [Google Scholar]
  38. J. Wojewoda-Budka, Z. Huber, L. Litynska-Dobrzynska, N. Sobczak, P. Zieba, Microstructure and chemistry of the SAC/ENIG interconnections, Mater. Chem. Phys. 139 (2013) 276–280 [CrossRef] [Google Scholar]
  39. G. Ghosh, Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints, Acta Mater. 49 (2001) 2609–2624 [CrossRef] [Google Scholar]
  40. M.A. Fazal, N.K. Liyana, S. Rubaiee, A. Anas, A critical review on performance, microstructure and corrosion resistance of Pb-free solders, Meas. J. Int. Meas. Confed. 134 (2019) 897–907 [CrossRef] [Google Scholar]
  41. K.S. Tan, N.M. Noordin, K.Y. Cheong, An overview of die-attach material for high temperature applications, AIP Conf. Proc., 1865 (2017) 050011 [Google Scholar]
  42. N. Ismail et al., A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints, J. Manuf. Process. 83 (2022) 68–85 [CrossRef] [Google Scholar]
  43. X. Yi, R. Zhang, X. Hu, Study on the microstructure and mechanical property of Cu-foam modified Sn3. 0Ag0.5Cu solder joints by ultrasonic-assisted soldering, J. Manuf. Process. 64 (2021) 508–517 [CrossRef] [Google Scholar]
  44. L. Sun, L. Zhang, Y. Zhang, M. he Chen, C. ping Chen, Interfacial reaction, shear behavior and microhardness of Cu-Sn TLP bonding joints bearing CuZnAl powder for 3D packaging, J. Manuf. Process. 68 (2021) 1672–1682 [Google Scholar]
  45. A. Larsson, T.A. Tollefsen, O.M. Løvvik, K.E. Aasmundtveit, A Review of Eutectic Au-Ge Solder Joints, Metall. Mater. Trans. A Phys. Metall. Mater. Sci. 50 (2019) 4632–4641 [CrossRef] [Google Scholar]
  46. J.E. Spinelli, B.L. Silva, A. Garcia, Microstructure, phases morphologies and hardness of a Bi-Ag eutectic alloy for high temperature soldering applications, Mater. Des. 58 (2014) 482–490 [CrossRef] [Google Scholar]
  47. T. Gancarz, J. Pstrus, G. Cempura, K. Berent, Influence of Li Addition to Zn-Al Alloys on Cu Substrate During Spreading Test and After Aging Treatment, J. Electron. Mater. 45 (2016) 6067–6078 [CrossRef] [Google Scholar]
  48. Y. Su et al., Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores, Comput. Methods Appl. Mech. Eng. 378 (2021) 113729 [CrossRef] [Google Scholar]
  49. J. Watson and G. Castro, A review of high-temperature electronics technology and applications, J. Mater. Sci. Mater. Electron. 26 (2015) 9226–9235 [CrossRef] [Google Scholar]
  50. K. Suganuma, S.J. Kim, K.S. Kim, High-temperature lead-free solders: Properties and possibilities, JOM 61 (2009) 64–71 [CrossRef] [Google Scholar]
  51. H. Zhang, J. Minter, N.-C. Lee, A Brief Review on High-Temperature, Pb-Free Die-Attach Materials, J. Electron. Mater. 48 (2018) 201–210 [Google Scholar]
  52. B. Wu, X. Leng, Z. Xiu, J. Yan, Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasound, Ultrason. Sonochem. 44 (2018) 280–287 [CrossRef] [Google Scholar]
  53. Y. Takaku, L. Felicia, I. Ohnuma, R. Kainuma, K. Ishida, Interfacial reaction between Cu substrates and Zn-Al base high-temperature Pb-free solders, J. Electron. Mater. 37 (2008) 314–323 [CrossRef] [Google Scholar]
  54. T. Shimizu, H. Ishikawa, I. Ohnuma, K. Ishida, Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use, J. Electron. Mater. 28 (1999) 1172–1175 [CrossRef] [Google Scholar]
  55. C. Liu, A. Liu, Y. Su, Z. Zhou, C. Liu, Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging, Microelectron. Reliab. 126 (2021) 114241 [CrossRef] [Google Scholar]
  56. M.H. Yu, S.J. Joo, H.S. Kim, Multi-pulse flash light sintering of bimodal Cu nanoparticle-ink for highly conductive printed Cu electrodes, Nanotechnology 28 (2017) 205205 [CrossRef] [Google Scholar]
  57. G. Zeng, S. McDonald, K. Nogita, Development of high-temperature solders: Review, Microelectron. Reliab. 52 (2012) 1306–1322 [CrossRef] [Google Scholar]
  58. K.S. Siow, Y.T. Lin, Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study, J. Electron. Packag. Trans. ASME, 138 (2016) 020804 [CrossRef] [Google Scholar]
  59. V.R. Manikam, K.Y. Cheong, Die attach materials for high temperature applications: A review, IEEE Trans. Components, Packag. Manuf. Technol. 1 (2011) 457–478 [CrossRef] [Google Scholar]
  60. S. Menon, E. George, M. Osterman, M. Pecht, High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives, J. Mater. Sci. Mater. Electron. 26 (2015) 4021–4030 [CrossRef] [Google Scholar]
  61. D.J. Jeanmonod, Rebecca K. K., et al., Suzuki, M. Hrabovsky, M. P. Mariana Furio Franco Bernardes, Lilian Cristina Pereira and Daniel Junqueira Dorta, high-performance packaging technology for wide bandgap semiconductor modules, Intech Open 2 (2018) 64 [Google Scholar]
  62. M.H. Tsai, Y.W. Lin, H.Y. Chuang, C.R. Kao, Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate, J. Mater. Res. 24 (2009) 3407–3411 [CrossRef] [Google Scholar]
  63. C.C. Chang, H.Y. Chung, Y.S. Lai, C.R. Kao, Interaction between Ni and Cu across 95Pb-5Sn high-lead layer, J. Electron. Mater. 39 (2010) 2662–2668 [CrossRef] [Google Scholar]
  64. J.M. Song, H.Y. Chuang, Z.M. Wu, Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates, J. Electron. Mater. 35 (2006) 1041–1049 [CrossRef] [Google Scholar]
  65. C.P. Lin, C.M. Chen, Y.W. Yen, H.J. Wu, S.W. Chen, Interfacial reactions between high-Pb solders and Ag, J. Alloys Compd. 509 (2011) 3509–3514 [CrossRef] [Google Scholar]
  66. V. Chidambaram, J. Hald, J. Hattel, Development of Au-Ge based candidate alloys as an alternative to high-lead content solders, J. Alloys Compd. 490 (2010) 170–179 [CrossRef] [Google Scholar]
  67. J.W. Yoon, H.S. Chun, S.B. Jung, Liquid-state and solid-state interfacial reactions of fluxless-bonded Au-20Sn/ENIG solder joint, J. Alloys Compd. 469 (2009) 108–115 [CrossRef] [Google Scholar]
  68. M.A. Alim, M.Z. Abdullah, M.S.A. Aziz, R. Kamarudin, Die attachment, wire bonding, and encapsulation process in LED packaging: A review, Sensors Actuators, A Phys. 329 (2021) 112817 [CrossRef] [Google Scholar]
  69. X. Wang, L. Zhang, M. Li, Structure and Properties of Au-Sn Lead-Free Solders in Electronic Packaging, Mater. Trans. 63 (2022) 93–104 [CrossRef] [Google Scholar]
  70. J. Xu, M. Wu, J. Pu, S. Xue, Novel Au-based solder alloys: A potential answer for electrical packaging problem, Adv. Mater. Sci. Eng. 2020 (2020) doi: 10.1155/2020/4969647 [Google Scholar]
  71. C. Leinenbach, F. Valenza, D. Giuranno, H.R. Elsener, S. Jin, R. Novakovic, Wetting and soldering behavior of eutectic Au-Ge alloy on Cu and Ni substrates, J. Electron. Mater. 40 (2011) 1533–1541 [CrossRef] [Google Scholar]
  72. B. Ressel, K.C. Prince, S. Heun, Y. Homma, Wetting of Si surfaces by Au-Si liquid alloys, J. Appl. Phys. 93 (2003) 3886–3892 [CrossRef] [Google Scholar]
  73. V. Chidambaram, H.B. Yeung, G. Shan, Reliability of Au-Ge and Au-Si eutectic solder alloys for high-temperature electronics, J. Electron. Mater. 41 (2012) 2107–2117 [CrossRef] [Google Scholar]
  74. J.W. Yoon, B.I. Noh, S.B. Jung, Interfacial reaction between Au-Sn solder and Au/Ni-metallized Kovar, J. Mater. Sci. Mater. Electron. 22 (2011) 84–90 [CrossRef] [Google Scholar]
  75. H.M. Chung, C.M. Chen, C.P. Lin, C.J. Chen, Microstructural evolution of the Au-20 wt.% Sn solder on the Cu substrate during reflow, J. Alloys Compd. 485 (2009) 219–224 [CrossRef] [Google Scholar]
  76. H. Zhang, N.C. Lee, High reliability high melting mixed lead-free BiAgX solder paste system, Proc. IEEE/CPMT Int. Electron. Manuf. Technol. Symp. (2012) 119–126 [Google Scholar]
  77. J.M. Song, H.Y. Chuang, T.X. Wen, Thermal and tensile properties of Bi-Ag alloys, Metall. Mater. Trans. A Phys. Metall. Mater. Sci. 38 (2007) 1371–1375 [CrossRef] [Google Scholar]
  78. Z. Shen, K. Fang, R. Wayne Johnson, M.C. Hamilton, Characterization of Bi-Ag-X solder for high temperature sic die attach, IEEE Trans. Components, Packag. Manuf. Technol. 4 (2014) 1778–1784 [CrossRef] [Google Scholar]
  79. M. Nahavandi, M.A.A. Hanim, Z.N. Ismarrubie, A. Hajalilou, R. Rohaizuan, M.Z.S. Fadzli, Effects of silver and antimony content in lead-free high-temperature solders of Bi-Ag and Bi-Sb on copper substrate, J. Electron. Mater. 43 (2014) 579–585 [CrossRef] [Google Scholar]
  80. H.Y. Chuang, Z.M. Wu, Substrate dissolution and shear properties of the joints between Bi-Ag Alloys and Cu substrates for high-temperature soldering applications, J. Electron. Mater. 36 (2007) 1516–1523 [CrossRef] [Google Scholar]
  81. H. Li, Y. Li, C. Chen, Microstructure and formation mechanism of Al2O3/Zn5Al/2024Al joint by ultrasonic assisted soldering process, J. Manuf. Process. 83 (2022) 313–324 [CrossRef] [Google Scholar]
  82. A. Haque, B.H. Lim, A.S.M.A. Haseeb, H.H. Masjuki, Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame, J. Mater. Sci. Mater. Electron. 23 (2012) 115–123 [CrossRef] [Google Scholar]
  83. M. Mehedi, H. Ahmed, S.M. Abdul, Characteristics of eutectic and near − eutectic Zn − Al alloys as high − temperature lead − free solders, J. Mater. Sci. Mater. Electron. 31 (2020) 1691–1702 [CrossRef] [Google Scholar]
  84. M. Rettenmayr, P. Lambracht, B. Kempf, C. Tschudin, Zn-Al based alloys as Pb-free solders for die attach, J. Electron. Mater. 31 (2002) 278–285 [CrossRef] [Google Scholar]
  85. S.-S. Kim, K.-S. Kim, S.-J. Kim, C.-Y. Kang, K. Suganuma, Characteristics of Zn-Al-Cu Alloys for high temperature solder application, Mater. Trans. 49 (2008) 1531–1536 [CrossRef] [Google Scholar]
  86. L. Liu, L. Zhou, C. Liu, Electroless Ni-W-P alloy as a barrier layer between Zn-based high temperature solders and Cu substrates, Proc. − Electron. Components Technol. Conf. (2014) 1348–1353 [Google Scholar]
  87. A. Haque, Y.S. Won, B.H. Lim, A.S.M.A. Haseeb, H.H. Masjuki, Effect of Ni metallization on interfacial reactions and die attach properties of Zn-Al-Mg-Ga high temperature lead-free solder, Proc. IEEE/CPMT Int. Electron. Manuf. Technol. Symp. (2010) [Google Scholar]
  88. Y. Takaku et al., Interfacial reaction between Zn-Al-based high-temperature solders and Ni substrate, J. Electron. Mater. 38 (2009) 54–60 [CrossRef] [Google Scholar]
  89. T. Gancarz, J. Pstrusś, P. Fima, S. Mosinłska, Effect of Ag addition to Zn-12Al alloy on kinetics of growth of intermediate phases on Cu substrate, J. Alloys Compd. 582 (2014) 313–322 [CrossRef] [Google Scholar]
  90. C. Chen et al., Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices, Acta Mater. 129 (2017) 41–51 [CrossRef] [Google Scholar]
  91. Y. Yuan, H. Wu, J. Li, P. Zhu, R. Sun, Applied Surface Science Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition, Appl. Surf. Sci. 570 (2021) 151220 [CrossRef] [Google Scholar]
  92. C. Chen et al., Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules, Ceram. Int. 45 (2019) 9573–9579 [CrossRef] [Google Scholar]
  93. D. Ishikawa et al., Bonding strength of Cu sinter die-bonding paste on Ni, Cu, Ag, and Au Surfaces under pressureless bonding process, Trans. Japan Inst. Electron. Packag. 13 (2020) E19-017-1-E19-017–11 [Google Scholar]
  94. C. Liu, A. Liu, Y. Zhong, S. Robertson, Z. Zhou, C. Liu, Ultrasonic-assisted nano Ag-Al alloy sintering to enable high-temperature electronic interconnections, Proc. − Electron. Components Technol. Conf., 2020-June (2020) 1999–2004 [Google Scholar]
  95. J. Yan, A review of sintering-bonding technology using ag nanoparticles for electronic packaging, Nanomaterials 11 (2021) 927 [CrossRef] [Google Scholar]
  96. M.Y. Wang, Y.H. Mei, R. Burgos, D. Boroyevich, G.Q. Lu, Effect of substrate surface finish on bonding strength of pressure-less sintered silver die-Attach, 2018 Int. Conf. Electron. Packag. iMAPS All Asia Conf. ICEP-IAAC 2018 (2018) 50–54 [Google Scholar]
  97. C. Chen, K. Suganuma, T. Iwashige, K. Sugiura, K. Tsuruta, High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates, J. Mater. Sci. Mater. Electron. 29 (2018) 1785–1797 [CrossRef] [Google Scholar]

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