Original Article

Multi-objective intelligent optimization design of a bioinspired spider-web microchannel heat sink

¹ School of Electrical and Mechanical Engineering, Soochow University, Suzhou 215137, PR China
² Shanghai Aerospace Electronic Communication Equipment Institute, Shanghai 201109, PR China
³ Shanghai Key Laboratory of Collaborative Computing in Space Heterogeneous Networks (CCSN), Shanghai 201109, PR China
⁴ School of Rail Transportation, Soochow University, Suzhou 215137, PR China

^* e-mails: This email address is being protected from spambots. You need JavaScript enabled to view it. ; This email address is being protected from spambots. You need JavaScript enabled to view it.

Received: 12 December 2025
Accepted: 24 December 2025

Abstract

With the rapid increase in chip computing power, the heat flux density has sharply increased, becoming one of the bottlenecks restricting chip performance. This study presents a synergistic approach to thermal management by integrating a bioinspired spider-web microchannel heat sink with intelligent optimization. A multi-objective particle swarm optimization algorithm was employed to systematically optimize channel geometry, maximizing heat transfer while minimizing pressure loss. The TOPSIS-based decision-making identified an optimal solution that increases the convective heat transfer coefficient by 35.2% while reducing pressure loss by 8.3%. And, this advantage is particularly evident at 320 W/cm², with a maximum temperature reduction of 9.68 K. It means that the proposed structure significantly enhances both thermal and hydraulic performance compared to conventional designs, with improvements becoming more pronounced under increasing heat flux. Finally, the diamond/copper composite material was used to prepare the microchannel heat sink, and the heat dissipation performance of the designed biomimetic heat sink was verified by loop test. This work demonstrates the strong potential of combining bioinspired design with intelligent optimization for advanced thermal management in high-heat-flux applications.