EDP Sciences logo
Submit your paper
Search
Menu
Home All issues Volume 13 (2026) Manufacturing Rev., 13 (2026) 3 References
Open Access
Issue
Manufacturing Rev.
Volume 13, 2026
Article Number 3
Number of page(s) 15
DOI https://doi.org/10.1051/mfreview/2025032
Published online 04 February 2026
  1. S.Y. Shi, S.Z. Hu, Y.K. Ding, S.F. Wang, J.Y. Du, J.W. Zhang, W. Wang, C. Zhang, Review of two-phase liquid cooling technology for aerospace processing chips, Aerosp. Shanghai. (2025) 1–22 [Google Scholar]
  2. H. Jiang, X. Wang, C. Ding, D. Shan, B.H. Guo, Qi, J. Xu, A review of emerging design and theoretical progress on vapor chamber for efficient thermal performance, Int. J. Heat Mass Transfer 231 (2024) 125814 [Google Scholar]
  3. A. Narayanan, Q. Wang, S. Ozguc, R.W. Bonner, Investigation of server level direct-to-chip two phase cooling solution for high power GPUS; ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. (2024) InterPACK2024-141261 [Google Scholar]
  4. Y.W. Wang, W.Z. Li, C. Qi, J. Yu, Thermal management of electronic components based on hierarchical microchannels and nanofluids, Therm. Sci. Eng. Prog 42 (2023) 101910 [Google Scholar]
  5. D.L. Xian, Development and application of microchannel-based chip heatdissipation technology, Southeast University, 2023 [Google Scholar]
  6. B. Lei, L.L. Zhang, K.M. Kang, Thermal design and simulation of high performance computer for spacecraft equipment, Electro-Mech. Eng. 37 (2021) 29–32 [Google Scholar]
  7. L. Du, W. Hu, An overview of heat transfer enhancement methods in microchannel heat sinks, Chem. Eng. Sci 280 (2023) 119081 [Google Scholar]
  8. J. Gao, Z. Hu, Q. Yang, X. Liang, H. Wu, Fluid flow and heat transfer in microchannel heat sinks: Modelling review and recent progress, Therm. Sci. Eng. Prog 29 (2022) 101203 [Google Scholar]
  9. Z.Q. Yu, M.T. Li, B.Y. Cao, A comprehensive review on microchannel heat sinks for electronics cooling, Int. J. Extreme Manuf. 6 (2024) 022005 [Google Scholar]
  10. D.B. Tuckerman, R.F.W. Pease, High-performance heat sink for VLSI, IEEE Electron. Device Lett. EDL-2 (1981) 126–129 [Google Scholar]
  11. Z.P. Chen, B. Yuan, J. Yang, Z. Zhang, Y.Q. Tang, Y. Yang, H.S. Zheng, Y. Chen, Numerical simulation of a novel composite microchannel for large-scale THz phased array antennas thermal management, Int. J. Therm. Sci 214 (2025) 109924 [Google Scholar]
  12. Y.T. Shen, Y.H. Pan, H. Chen, W.L. Cheng, Experimental study of embedded manifold staggered pin-fin microchannel heat sink, Int. J. Heat Mass Transfer 226 (2024) 125488 [Google Scholar]
  13. C. Ao, B. Xu, Z.Q. Chen, Dual-layer cylindrical array of pin–fin microchannels with heat dissipation capacity up to 1200 W/cm2, Int. J. Heat Fluid Flow 116 (2025) 110003 [Google Scholar]
  14. L. Yin, J.Q. E, Y. Tu, W.H. Luo, Biomimetic microchannel structures and their topological optimization: a review, Int. Commun. Heat Mass Transfer 163 (2025) 108689 [Google Scholar]
  15. S.J. Wu, K. Zhang, G. Song, J.C. Zhu, B.R. Yao, Experimental study on the performance of a tree-shaped mini-channel liquid cooling heat sink, Case Stud. Therm. Eng 30 (2022) 101780 [Google Scholar]
  16. X.h. Han, H.l. Liu, G. Xie, L. Sang, J. Zhou, Topology optimization for spider web heat sinks for electronic cooling, Appl. Therm. Eng 195 (2021) 117154 [Google Scholar]
  17. K.C. Wang, Y. Shi, J.J. Chen, Y.C. Dai, A biomimetic microchannel heat sink for enhanced thermal performance in chip cooling, Biomimetic 10 (2025) 459 [Google Scholar]
  18. L.W. Wu, T. Lu, J.J. Chen, M.Y. Wang, P. An Du, A study of bionic micro-channel topology for chip cooling, Acta Electron. Sin 46 (2018) 1153–1157 [Google Scholar]
  19. G.G. Song, H.Q. Chen, Y.H. Zhang, J.J. Wei, X. Ma, Reviews: applications of optimization algorithm for microchannel and microchannel heat sink on heat transfer, Int. J. Heat Fluid Flow 108 (2024) 109451 [Google Scholar]
  20. K.J. Lu, C.J. Wang, H.D. He, X.L. Fan, F. Chen, F. Qi, Artificial neural network prediction and multi-objective genetic algorithm optimization of the microchannel heat sink with trapezoidal ribs, Therm. Sci. Eng. Prog 50 (2024) 102546 [Google Scholar]
  21. Y. Liu, S.Q. Lv, Q.L. Cui, Y.J. Xia, M.X. Jiang, J. Lv, M.R. Huang, Y.X. Xue, Device packaging and integration optimization based on neural network method: effect of microchannel structure on heat sink performance, Mater. Sci. Semicond. Process 185 (2025) 108977 [Google Scholar]
  22. J.Z. Zhang, J.J. Xu, J. An, J.X. Chen, Y. Liu, Q. Zhou, H.F. Pan, L. Lei, G.M. Xin, Multi objective optimization of manifold microchannel heat sink with staggered microchannels, Int. Commun. Heat Mass Transfer 159 (2024) 108106 [Google Scholar]
  23. H. Tan, L.W. Wu, M.Y. Wang, Z.H. Yang, P.G. Du, Heat transfer improvement in microchannel heat sink by topology design and optimization for high heat flux chip cooling, Int. J. Heat Mass Transfer 129 (2019) 681–689 [CrossRef] [Google Scholar]
  24. K.J. Lu, C.J. Wang, H.D. He, X.L. Fan, F. Chen, F. Qi, Study of the hot-pressing sintering process of diamond/copper composites and their thermal conductivity, J. Alloys Compd 960 (2023) 170608 [Google Scholar]

Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.

Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.

Initial download of the metrics may take a while.