Open Access
Review
Table 10
Classification of the of the modelling studies on the MJ AM process.
Reference number | KPI | Process/Part parameter (Variable) |
---|---|---|
[17–19] | Etching, deposition, lithography mechanics | Surface type, material, shape |
[143] | Deformation behavior of droplets | Impact angle |
[144] | Stiffness | Spatial orientation of reinforcement in randomly oriented multi material |
[145] | Pressure, axial velocity histories | |
[104] | Fingering and splashing of the droplet | Droplet velocity |
[105] | Desired shape after impact | Initial droplet shape |
[106] | Microstructure, temperature field | Number of layers, layer height, wire feed rate, travel speed, heat input |
[111] | Spreading and evaporation | Droplet material |
[147] | Droplet volume, temperature, and pressure | Heating pulse conditions |
[148] | Pressure rise, ink injection length, droplet weight | Electric pulse shape and voltage |
[149] | Vapor blanket height between the evaporating droplet, substrate, formation of vapor bubbles | Temperature |
[150] | Drop formation, ejection, spread and flow of ceramic inks in micro-channels | Solid loading concentrations of alumina/zirconia powder in ceramic inks |
[151] | Pressure propagation in the bubble | |
[152] | Magnitude of the circular thin film of the incoming droplets | Impact velocity |
[153] | Droplet morphology, break-up time, flying distance, droplet volume | |
[154] | Droplet volume, droplet velocity | Driving time, driving volume in the pressure chamber, volume factor |
[155] | Droplet fluid dynamics and heat transfer related |
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