Classification of the of the modelling studies on the MJ AM process.
|Reference number||KPI||Process/Part parameter (Variable)|
|[17–19]||Etching, deposition, lithography mechanics||Surface type, material, shape|
|||Deformation behavior of droplets||Impact angle|
|||Stiffness||Spatial orientation of reinforcement in randomly oriented multi material|
|||Pressure, axial velocity histories|
|||Fingering and splashing of the droplet||Droplet velocity|
|||Desired shape after impact||Initial droplet shape|
|||Microstructure, temperature field||Number of layers, layer height, wire feed rate, travel speed, heat input|
|||Spreading and evaporation||Droplet material|
|||Droplet volume, temperature, and pressure||Heating pulse conditions|
|||Pressure rise, ink injection length, droplet weight||Electric pulse shape and voltage|
|||Vapor blanket height between the evaporating droplet, substrate, formation of vapor bubbles||Temperature|
|||Drop formation, ejection, spread and flow of ceramic inks in micro-channels||Solid loading concentrations of alumina/zirconia powder in ceramic inks|
|||Pressure propagation in the bubble|
|||Magnitude of the circular thin film of the incoming droplets||Impact velocity|
|||Droplet morphology, break-up time, flying distance, droplet volume|
|||Droplet volume, droplet velocity||Driving time, driving volume in the pressure chamber, volume factor|
|||Droplet fluid dynamics and heat transfer related|
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