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Review

Table 10

Classification of the of the modelling studies on the MJ AM process.

Reference number KPI Process/Part parameter (Variable)
[1719] Etching, deposition, lithography mechanics Surface type, material, shape
[143] Deformation behavior of droplets Impact angle
[144] Stiffness Spatial orientation of reinforcement in randomly oriented multi material
[145] Pressure, axial velocity histories  
[104] Fingering and splashing of the droplet Droplet velocity
[105] Desired shape after impact Initial droplet shape
[106] Microstructure, temperature field Number of layers, layer height, wire feed rate, travel speed, heat input
[111] Spreading and evaporation Droplet material
[147] Droplet volume, temperature, and pressure Heating pulse conditions
[148] Pressure rise, ink injection length, droplet weight Electric pulse shape and voltage
[149] Vapor blanket height between the evaporating droplet, substrate, formation of vapor bubbles Temperature
[150] Drop formation, ejection, spread and flow of ceramic inks in micro-channels Solid loading concentrations of alumina/zirconia powder in ceramic inks
[151] Pressure propagation in the bubble  
[152] Magnitude of the circular thin film of the incoming droplets Impact velocity
[153] Droplet morphology, break-up time, flying distance, droplet volume  
[154] Droplet volume, droplet velocity Driving time, driving volume in the pressure chamber, volume factor
[155] Droplet fluid dynamics and heat transfer related  

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