Open Access
Review
Table 7
Classification of the of the modelling studies on the DED AM process.
| Reference number | KPI | Process/Part parameter (Variable) |
|---|---|---|
| [17–19] | Etching, deposition, lithography mechanics | Surface type, material, shape |
| [32] | Residual stresses, distortions | |
| [41] | System temperature | |
| [49] | Heat transfer related | |
| [50] | Part temperature history | Layer position in the part under construction |
| [78] | Surface finish | Melt-pool geometries, layer thickness, powder/laser interaction distance |
| [79] | Surface finish, melt pool, dilution ratio | Laser power, scanning speed, and powder feed rate |
| [82,83] | Clad width, depth and height | Process speed, powder feed rate |
| [81] | Track and microstructure formation |
Scanner speed, stand-off distance, diameter ratio of the clad to powder stream for Gaussian mode distribution |
| [84] | Layer/melt pool dimensions | Laser power, powder mass flux |
| [85] | Shapes of manufactured structures, thermal loads | |
| [86] | Local temperature history, track profile, microstructure scale | |
| [87] | Spreading, cooling and solidification processes of droplets | Substrate velocity |
| [88] | Thickness of the deposition layer, the depth of the molten pool, the penetration of the substrate or previous deposited layer | Scanning speed, powder feeding rate, input electric current |
| [89] | Residual stresses, distortion | High speed machining post-process |
| [90] | Thermal modelling, residual stresses, thermal distortions | Temperature history |
| [91] | Temperature, stress field | Deposition pattern |
| [92] | Stresses, strains | Heat input, layer thickness |
| [95] | Bead geometry (layer thickness, dimensional precision) | Welding speed, wire feed rate, arc voltage |
| [96] | Microstructure, mechanical properties | Pre-heating of substrate, scanning speed, idle time |
| [93] | Residual stresses | Melt pool geometry, metal powder flow rate, laser power, scanning speed, scanning direction, and deposition layer thickness |
| [97] | Microstructure, hardness, residual stresses | Deposition parameters |
| [94] | Residual stress history, microstructure | Phase change |
| [98] | Total spread of droplet, solidification front speed, interlamellar spacing | Droplet size, speed, superheat |
| [99] | Microstructure, hardness | Substrate size, idle time |
| [100] | Powder-to-solid transition | Temperature, porosity-dependent conduction |
| [101] | Grain size, grain growth speed, | Temperature, deposition over time |
| [115] | Thermal history | Laser-scan velocities |
| [102] | Spreading and shape of the droplet after impact | Substrate roughness and temperature, speed of droplet |
| [103] | Splashing of droplets | Impact velocity, temperature |
| [104] | Fingering and splashing of the droplet | Droplet velocity, liquid type, temperature of surface, surface roughness, contact angle |
| [105] | Desired shape after impact | Initial droplet shape |
| [106] | Microstructure, temperature field | Number of layers, layer height, wire feed rate, travel speed, heat input |
| [107] | Droplet spreading, final deposit shapes times needed for initialization and completion of freezing | Initial droplet temperature, impact velocity, thermal contact resistance and initial substrate temperature |
| [108] | Fluid dynamics, Heat transfer related and phase-change of droplet | |
| [109] | Droplet generating frequency | Disturbance frequency |
| [110] | Solder bump characteristics, shape | Solder solidification |
| [111] | Spreading and evaporation | Droplet material |
| [112] | Droplet deformation and solidification, Heat transfer related in the substrate, maximum spread diameter | |
| [113] | Maximum spread factor, solidification parameter | Impact velocity and substrate temperature |
| [114] | Laser attenuation and powder temperatures | |
| [116] | Heat transfer related, phase changes, and fluid flow in the molten pool | |
| [117] | Thermal modelling, calibration of input parameters utilizing IR imaging | |
| [118] | Thermal history, residual stresses | Induction heating patterns |
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