Open Access

Table 3

Summary of applications and methods for thin-film deposition processes [24].

Criterion for deposition process Deposition processes

PVD CVD Thermal spray
E-beam evaporation RF Sputtering Cathodic arc PECVD APS/SPPS
Mechanism of production of depositiong species Thermal energy Momentum transfer Thermal energy Chemical reaction Flames or plasma
Deposition rate Can be very high (up to 750 000 Å/min) Low Can be very high Moderate (200–2500 Å/min) Very high
Deposition species Atoms & ions Atoms & ions Ions Atoms Droplets
Uniformity for complex shaped objects Poor, line of sight coverage except by gas scattering Good, nonuniform, uniform thickness distributions Good, but nonuniform thickness distribution Good No
Energy of deposited species Low (∼0.1–0.5 eV) Can be high (1–100 eV) Very high Can be high Very high
Bombardment of substrate/deposit by inert gas ions Generally no Yes or no, depending on geometry Yes Possible Yes
Substrate heating (by external means) Yes, normally Yes or no Yes or no Yes Not normally

Current usage metrics show cumulative count of Article Views (full-text article views including HTML views, PDF and ePub downloads, according to the available data) and Abstracts Views on Vision4Press platform.

Data correspond to usage on the plateform after 2015. The current usage metrics is available 48-96 hours after online publication and is updated daily on week days.

Initial download of the metrics may take a while.