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Table 1
Summary of process methods, solid materials and fluid media used in MCHS.
| References | Heat transfer method | Microchannel material | Processing methods | Type of coolant | Years |
|---|---|---|---|---|---|
| Perret et al. [7] | Passive | Copper | Wet chemical etching | Water | 1998 |
| Wu and Cheng [8] | Passive | Silicon | Wet etching | Deionized water | 2003 |
| Chen et al. [9] | Passive | Silicon | Etch | Deionized water | 2009 |
| Gunnasegaran et al. [10] | Passive | Aluminum | – | Water | 2010 |
| Wang et al. [11] | Passive | Oxygen-free copper | – | Deionized water | 2016 |
| Vinoth and Senthil Kumar [12] | Passive | Copper | Wire cut electrical discharge machining | Water and Al2O3/water nanofluid | 2017 |
| Moradikazerouni et al. [13] | Passive | aluminum, alumina (92%), cobalt, stainless steel, copper, and silver | – | Air | 2019 |
| Alihosseini et al. [14] | Passive | Copper | – | Water | 2021 |
| Hao et al. [15] | Passive | 6061 aluminum | – | Water | 2014 |
| Al-Neama et al. [16] | Passive | Copper | CNC | Water | 2018 |
| Cao et al. [17] | Passive | Copper | EDM | Water | 2020 |
| Jaffal et al. [18] | Passive | Copper | CNC | Water | 2021 |
| Imran et al. [19] | Passive | Copper | – | Water | 2018 |
| Gorzin et al. [20] | Passive | Aluminum alloy | CNC | Water | 2022 |
| Peng et al. [21] | Passive | Copper | Wire cutting | Deionized water | 2021 |
| Chen and Cheng [22] | Passive | Silicon | Etch | Deionized water | 2005 |
| Zhang et al. [23] | Passive | – | – | Water | 2011 |
| Fan et al. [25] | Passive | Aluminum | Water | 2022 | |
| Shui et al. [26] | Passive | Copper | Micro-milling | Steam/air | 2018 |
| Ran et al. [27] | Passive | Aluminum | – | Water | 2022 |
| Luo et al. [28] | Passive | Copper | Laser engraving and mould coining | Deionized water | 2020 |
| Li et al. [29] | Passive | Aluminum | CNC | Deionized water | 2019 |
| Peng et al. [31] | Passive | Copper | – | Water | 2021 |
| Tan et al. [32] | Passive | 6063 aluminum | 3D printing technique | Water | 2019 |
| Tan et al. [33] | Passive | 6063 aluminum alloy | 3D printing technique | HFE7200 | 2021 |
| Han et al. [34] | Passive | Aluminum | 3D printing technique | Water | 2021 |
| Hu et al. [35] | Passive | Silicon | Etch | Deionized water | 2019 |
| Wang et al. [36] | Passive | Aluminum | – | Water | 2021 |
| Li et al. [37] | Passive | – | – | Water | 2020 |
| Wang et al. [38] | Passive | Copper | CNC | Deionized water | 2019 |
| Zhang et al. [39] | Passive | – | – | Liquid ammonia | 2010 |
| Behnampour et al. [40] | Passive | – | – | Nanofluid | 2017 |
| Rehman et al. [41] | Passive | Copper | – | Water | 2019 |
| Rehman et al. [42] | Passive | Copper | – | Nanofluid | 2020 |
| Chai et al. [43–45] | Passive | Silicon | – | Water | 2016 |
| Derakhshanpour et al. [46] | Passive | Silicon | – | Water | 2020 |
| Adhikari et al. [47] | Passive | anodized Aluminum 6063 −T5 alloy | – | Air | 2020 |
| Ben Hamida and Hatami [48] | Passive | Aluminum | – | Al2O3/water nanofluid | 2021 |
| Ali et al. [49] | Passive | – | – | Water | 2020 |
| Sun et al. [50] | Passive | Copper | – | Water | 2022 |
| Zhang et al. [51] | Passive | Aluminum | CNC | Water | 2022 |
| Wang et al. [52] | Passive | Silicon | Etch | HFE-7000 | 2018 |
| Vasilev et al. [53] | Passive | Copper | – | Water | 2021 |
| Lyu et al. [54] | Passive | Copper | Sinter | Air | 2020 |
| Yan et al. [55] | Passive | Silicon | – | HFE7100 | 2022 |
| Pan et al. [56] | Passive | Silicon | – | HFE7100 | 2022 |
| Sreehari and Prajapati [57] | Passive | Copper | – | Water and nanofluid | 2021 |
| Jia et al. [58] | Passive | Silicon | – | Deionized water | 2018 |
| Zheng et al. [59] | Passive | Copper | UV-LGA | Deionized water | 2022 |
| Wang et al. [60] | Passive | Silicon | inductively coupled plasma reactive ion etching | Deionized water | 2019 |
| Chen et al. [61] | Passive | Copper | Micro-milling | Water | 2022 |
| Chai et al. [62] | Passive | Silicon | – | Water | 2011 |
| Xia et al. [63] | Passive | Silicon | – | Water | 2011 |
| Li et al. [64] | Passive | Silicon | – | Al2O3-water nanofluid | 2019 |
| Kumar and Kumar [65] | Passive | – | – | Water | 2021 |
| Xia et al. [66] | Passive | Silicon | – | Deionized water | 2015 |
| Zhu et al. [67] | Passive | Silicon | – | Deionized water | 2020 |
| Pan et al. [68] | Passive | Copper | – | Water | 2019 |
| Pan et al. [69] | Passive | Copper | Micro-milling | Deionized water | 2019 |
| Bi et al. [70] | Passive | – | – | Water | 2013 |
| Zontul et al. [71] | Passive | 6061 aluminum | – | Water | 2021 |
| Liu et al. [72] | Passive | – | – | Water | 2019 |
| Shui et al. [73] | Passive | Copper | Micro-milling | Air | 2018 |
| Huang et al. [74] | Passive | Copper | – | Water | 2020 |
| Yao et al. [75] | Passive | Silicon | – | Water | 2021 |
| Li et al. [76] | Passive | Silicon | – | Deionized water | 2020 |
| Feng et al. [77] | Passive | Silicon | – | Water | 2021 |
| Deng et al. [78] | Passive | Copper | Micro-milling | Deionized water and ethanol | 2019 |
| Walunj and Sathyabhama [79] | Passive | Copper | Wire edm | Deionized water | 2018 |
| Li et al. [80] | Passive | Copper | Laser etching | Deionized water | 2022 |
| Deng et al. [81] | Passive | cooper (99.9% Cu) | micro wire electrical discharge machining | Deionized water and ethanol | 2017 |
| Zhu et al. [82] | Passive | Silicon | Etch | Degassed and high purity water | 2016 |
| Wan et al. [83] | Passive | Copper | Laser micro-milling | Deionized water | 2017 |
| Deng et al. [84] | Passive | Copper | solid-state sintering | water and ethanol | 2016 |
| Sun et al. [85] | Passive | Pure copper | orthogonal Ploughing/Extrusion (P/E) | Deionized water | 2017 |
| Zeng et al. [86] | Passive | Copper | orthogonal Ploughing/Extrusion | Deionized water | 2017 |
| Chen et al. [87] | Passive | Copper | Orthogonal Ploughing/Extrusion | Deionized water | 2020 |
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