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Fig. 14
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Microstructures of Cu/molten Zn-4Al-1Cu (a) soldered at 450 °C for 5 min showing consumption of the Cu substrate depth d, (b) soldered at 530 °C for 45 min showing IMPs of e, c, and b, and (c) a magnified view of (b) near the interface of c, b, and Cu [53].
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