An analytical review on interfacial reactions in high-temperature die-attach: the insights into the effect of surface metallization and filler materials

Advanced Manufacturing Research – Latest Developments

Open Access

Review

Fig. 7

Average thickness of intermetallic layer for Ni/95Pb-5Sn/Cu diffusion couples: (a) Ni₃Sn₄ on Ni side and (b) Cu₃Sn on Cu side [63].

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