Table 2
Advantages and disadvantages of commonly used substrate and metallization in electronics packaging.
| Substrate or surface finish | Advantages | Disadvantages |
|---|---|---|
| Cu substrate | Good mechanical property and thermal conductivity [26] | Easily oxidized or corrode, high solubility in molten solder [27,28] |
| Ni(P) metallization | Barrier layer | Cost effective, brittle if P is excessive [31] |
| Immersion Ag | Protect Cu from oxidation and corrosion [27] | High cost, micropores and defects in thin Ag layer [27] |
| Nickel Immersion Gold (ENIG) | Excellent solderability, excellent corrosion resistance [37] | Highest cost, use of cyanide, ‘black pad’ [37,38] |
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