Table 3
Solidus and liquidus temperature of typical high-temperature interconnection materials.
| Interconnection material system | Composition (Wt.%) | Solidus temperature (°C) | Liquidus temperature (°C) |
|---|---|---|---|
| High-Pb | |||
| Pb-5Sn [50] | 300 | 314 | |
| Pb-2.5Ag [50] | 304 | 304 | |
| Pb-1.5Ag-1Sn [50] | 309 | 309 | |
| Au Alloy | |||
| Au-20Sn [50] | 280 (eutectic) | 280 | |
| Au-3.2Si [51] | 363 (eutectic) | 363 | |
| Au-12Ge [51] | 361 (eutectic) | 361 | |
| Bi Alloy | |||
| Bi-2.5Ag [50] | 263 (eutectic) | 263 | |
| Bi-11Ag [50] | 263 | 360 | |
| Zn Alloy | Zn-5Al [52] | 381 (eutectic) | 381 |
| Zn-4Al-1Cu [53] | 380 | 380 | |
| Zn-4Al-3Mg-3Ga [54] | 309 | 347 | |
| Nano paste | Ag [55] | 961 | 961 |
| Cu [56] | 1064 | 1064 |
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