Table 4

Advantages and disadvantages of alloy systems for high-temperature die-attach [57,58].

Materials Advantages Disadvantages
High Pb Suitable melting temperature, good wettability and mechanical properties, stable microstructure Toxic, sensitive to Sn concentration
Au-Sn Fluxless, good creep resistance Expensive, brittle Au-Sn IMCs
Au-Ge Low elastic modulus, stable microstructure, high strength Expensive, difficult to manufacture
Zn-Al Low cost, easy to manufacture, no IMC formed Highly corrosive, poor wetting ability
Bi-Ag Acceptable melting point, affordable cost Poor workability, low conductivity
Nano Ag High electrical and thermal conductivities, low processing temperature Expensive, need pressure during sintering

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