Table 4
Advantages and disadvantages of alloy systems for high-temperature die-attach [57,58].
| Materials | Advantages | Disadvantages |
|---|---|---|
| High Pb | Suitable melting temperature, good wettability and mechanical properties, stable microstructure | Toxic, sensitive to Sn concentration |
| Au-Sn | Fluxless, good creep resistance | Expensive, brittle Au-Sn IMCs |
| Au-Ge | Low elastic modulus, stable microstructure, high strength | Expensive, difficult to manufacture |
| Zn-Al | Low cost, easy to manufacture, no IMC formed | Highly corrosive, poor wetting ability |
| Bi-Ag | Acceptable melting point, affordable cost | Poor workability, low conductivity |
| Nano Ag | High electrical and thermal conductivities, low processing temperature | Expensive, need pressure during sintering |
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