Table 7
Interfacial reaction products between metallization and high-temperature interconnection materials.
| Surface finish | Pb-5Sn | Bi-2.5Ag | Au-20Sn | Nano Ag | Zn-5Al |
|---|---|---|---|---|---|
| Bare Cu | Cu3Sn [62] | Cu-35Bi-5Ag solid solution [64] | AuCu/(Au, Cu)5Sn [75] | Cu-Ag solid solution [20] | CuZn/Cu5Zn8/CuZn4 [53] |
| Ni finish | Ni3Sn4 [63] | NiBi/NiBi3 [64] | (Ni, Au)3Sn2 [74] | Ni-Ag solid solution [20] | Al3Ni2 [88] |
| Ag finish | Ag3Sn [64] | Not reported | Not reported | Ag [20] | Not reported |
| ENIG | AuSn4 [34] | Not reported | (Ni, Au)3Sn2 [67] | Au-Ag solid solution [20] | Not reported |
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